At the award ceremony on November 16th 2017, Prof. Dr. Joerg Franke, 1st Chairman of the Research Association 3-D MID e.V., and Dr. Ingo Kriebitzsch, Chairman of the Research Committee of the Research Association, presented the award to the managing director of 2E mechatronic GmbH & Co. KG, Mr. Uwe Remer.
MAPLe Probe, a continence trainer made by Laser Direct Structuring (LDS), is an integral part of a system for diagnosing and treating pelvic floor dysfunction (incontinence). In order to ensure the success of the therapy, it was necessary to develop and produce a 3D-MID part in such a way that 24 electrodes were arranged in the prescribed manner in order to be able to control them separately. This was achieved by producing the connector as a male connector in LDS technology too. Since the product must be introduced into the human body, the MID part is first provided with a plastic inlay to ensure the necessary stability for the subsequent overmolding process with biocompatible plastic. The electrodes are cut out so that they can come into direct contact with the skin surface.
For the first time, this product successfully overmolded an LDS-MID with biocompatible material and put it into series production. This opens up new fields of application for MID components in medical technology. In addition, through the development of a suitable mating connector, it was possible to realize the required 24-pole contact via an integrally molded multipoint connector using LDS technology. After successfully completing a series of clinical trials, the device has been mass-produced since 2016. The volume of units currently stands at 10,000 units per year. The MAPLe probe has a high degree of technological sophistication and contributes to the promotion and further implementation of Mechatronic Integrated Devices. The Research Association 3-D MID e.V. therefore honors this application as an outstanding example of the use of MID technology with the MID Industry Award 2017.
About the Research Association Molded Interconnect Devices 3-D MID e.V.
With currently 106 members along the entire MID process chain, the Research Association Molded Interconnect Devices 3-D MID e.V. is the world’s largest network in the field of MID technology. The aim of the Research Association, founded in 1992, is the promotion and further development of MID technology. This technology allows the integration of mechanical, electrical, optical, thermal and fluidic functions in almost arbitrarily shaped components.
Not least due to the potential of printed electronics and additive manufacturing processes, there is an extension of the term MID as Molded Interconnect Devices to Mechatronic Integrated Devices. To this end, research projects are processed from own funding and public funds of the Federal Ministry of Economics and Energy. For the communication of the MID technology as well as for the exchange of information and experience, the research association organizes trade fair presentations, seminars and every two years the International Congress MID.
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