Meyer Burger Technology Ltd (SIX Swiss Exchange: MBTN) today announced the successful conclusion of repeat orders from two existing customers for its versatile DS 261 wire saw equipment for slicing and wafering applications in the semiconductor industry.

In response to the strong growing global demand for semi-wafers, the customers, global manufacturers in the semiconductor industry, are expanding their production capacity. The strategic selection of Meyer Burger’s DS 261 cutting equipment is based on their excellent experience with Meyer Burger’s technology from previous projects. It also underscores the customers’ confidence in Meyer Burger’s in-depth expertise in precision cutting technologies which enable the production of semiconductor wafers with outstanding surface qualities.

The total contractual value of both orders is about CHF 17.5 million. The orders comprise the installation, on-site training and service of the DS 261 wire saw equipment. Delivery of the equipment is scheduled to begin in the first half of 2019.

Über die Meyer Burger Technology AG

Meyer Burger is a leading global technology company specialising on innovative systems and processes based on semiconductor technologies. The company’s focus is on photovoltaics (solar industry) while its competencies and technologies also cover important areas of the semiconductor and the optoelectronic industries as well as other selected high-end markets based on semiconductor materials. Over the past ten years, Meyer Burger has risen to the forefront of the photovoltaic market and established itself as an international premium brand by offering superior precision products and innovative technologies.

Meyer Burger’s offering in systems, production equipment and services along the photovoltaic value chain includes the manufacturing processes for wafers, solar cells, solar modules and solar systems. Meyer Burger provides substantial added value to its customers and clearly differentiates itself from its competitors by focusing on core technologies of the value chain.

The company’s comprehensive product portfolio is complemented by a worldwide service network with spare parts, consumables, process know-how, customer support, after-sales services, training and other services. Meyer Burger is represented in Europe, Asia and North America in the respective key markets and has subsidiaries and own service centres in China, Germany, India, Japan, Korea, Malaysia, the Netherlands, Switzerland, Singapore, Taiwan and the USA. The company is also working intensively to develop new markets such as South America, Africa and the Arab region. The registered shares of Meyer Burger Technology Ltd are listed on the SIX Swiss Exchange (Ticker: MBTN).

Firmenkontakt und Herausgeber der Meldung:

Meyer Burger Technology AG
Schorenstrasse 39
CH3645 Gwatt (Thun)
Telefon: +41 (33) 2212800
Telefax: +41 (33) 2212808
http://www.meyerburger.com

Ansprechpartner:
Ingrid Carstensen
MEYER BURGER Technology AG
Telefon: +41 (33) 43938-34
E-Mail: ingrid.carstensen@meyerburger.com
Daniel Eicher
c/o Tolxdorff & Eicher Consulting
Telefon: +41 (33) 22128-83
E-Mail: daniel.eicher@meyerburger.com
Für die oben stehende Pressemitteilung ist allein der jeweils angegebene Herausgeber (siehe Firmenkontakt oben) verantwortlich. Dieser ist in der Regel auch Urheber des Pressetextes, sowie der angehängten Bild-, Ton-, Video-, Medien- und Informationsmaterialien. Die United News Network GmbH übernimmt keine Haftung für die Korrektheit oder Vollständigkeit der dargestellten Meldung. Auch bei Übertragungsfehlern oder anderen Störungen haftet sie nur im Fall von Vorsatz oder grober Fahrlässigkeit. Die Nutzung von hier archivierten Informationen zur Eigeninformation und redaktionellen Weiterverarbeitung ist in der Regel kostenfrei. Bitte klären Sie vor einer Weiterverwendung urheberrechtliche Fragen mit dem angegebenen Herausgeber. Eine systematische Speicherung dieser Daten sowie die Verwendung auch von Teilen dieses Datenbankwerks sind nur mit schriftlicher Genehmigung durch die United News Network GmbH gestattet.