Meyer Burger’s SmartWire Connection Technology selected by Panasonic Solar for evaluation in the manufacture of its innovative high efficiency solar modules

SmartWire Connection Technology (SWCT™) – the natural evolution in cell connection technology

Meyer Burger’s ground-breaking SmartWire Connection Technology employs an innovative foil-wire electrode with up to 24 perfectly aligned wires to connect solar cells. This reduces silver consumption per heterojunction solar module by over 50% which in turn reduces production costs for solar module manufacturers. The resulting dense wire contact matrix enables SWCT™ modules to easily cope with the increased power extraction necessary for today’s high efficiency heterojunction solar cells thereby delivering an increased performance yield in SWCT™ solar modules. The resulting structure of a SWCT™ module significantly strengthens its stability and enhances its lifetime. This powerful combination of higher energy yield, longer module lifetime and lower manufacturing costs make SWCT™ the most cost effective method of connecting solar cells on the market today.

Panasonic’s technology – industry-leading high performance technology

Panasonic produced PV modules HIT™ have a unique silicon heterojunction structure composed of crystalline silicon substrate and amorphous silicon layers. This technology performs the junction formation needed for solar cells by surrounding the crystalline silicon wafer with an amorphous silicon layer. Its high passivation capability compensates for multiple defects that occur around the surface of the silicon wafer. With industry-leading conversion efficiency and excellent temperature coefficient characteristics, Panasonic achieves high power generation even in a limited space. Panasonic has started to supply HIT™ cells with partners in addition to PV modules. Panasonic will expand BtoB business with partners globally.

HIT™ is a registered trademark of Panasonic Group.

The delivery and installation of Meyer Burger’s SWCT™ equipment at Panasonic’s R&D facility located in Osaka, Japan is planned in the second quarter of 2018 and is an initial step towards extending the adoption of SmartWire Connection Technology to other manufacturing locations.

The company’s comprehensive product portfolio is complemented by a worldwide service network with spare parts, consumables, process know-how, customer support, after-sales services, training and other services. Meyer Burger is represented in Europe, Asia and North America in the respective key markets and has subsidiaries and own service centres in China, Germany, India, Japan, Korea, Malaysia, the Netherlands, Switzerland, Singapore, Taiwan and the USA. The company is also working intensively to develop new markets such as South America, Africa and the Arab region. The registered shares of Meyer Burger Technology Ltd are listed on the SIX Swiss Exchange (Ticker: MBTN).

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