Flexible data acquisition through vertical modularity

ICP Deutschland has achieved this with the new ultra-compact ITG-100-AL Embedded PC through vertical modularity. Equipped with Intel® Atom™ x5-E3930 Apollo Lake SoC and 2GB pre-installed DDR3L memory, the palm-sized embedded PC has the following interfaces as standard: Two LAN GbE, one VGA, two RS-232/422/485 and two USB 3.0 interfaces. A second modular housing level, which is mounted below the base device, provides additional interfaces or extended mass storage space. Only a few steps are required for this, as the additional housing level is provided with cut-outs for two USB 2.0 and two RS-232 interfaces as well as a 2.5" SATA 6Gb/s SSD drive bay.

Furthermore, a MicroSD and an eMMC 5.0 slot as well as 8-bit digital I/O can be used optionally. The ITG-100-AL can also be extended via the available M.2 and PCIe mini slots. A wireless communication via WLAN and Bluetooth™ is also possible installing a M.2 2230-based WLAN module, two RF cables internally and two antennas externally. The extended temperature range from -20°C to +60°C and the DIN rail and wall mounting options offer flexible application scope.

Upon customer request, ICP Deutschland assembles the ITG-100-AL Embedded PC with industrial storage media, expansion cards and led out interfaces as ready-to-use system.

Specifications

• Ultra-compact Embedded PC with Intel® Atom™ x5-E3930 Apollo Lake SoC
• Max. 8GB DDR3L SO-DIMM memory
• COM, Dual LAN GbE, USB 3.0
• Expansions: M.2 and PCIe Mini slots
• Optional I/O: eMMC 5.0, MicroSD slot, USB 2.0, COM, 8-Bit digital I/O DIO
• VGA with Full-HD resolution
• Input voltage: 12VDC
• Operating temperature: -20°C ~ +60°C
• DIN-Rail or wall mounting

Applications

• Smart automation
• Data collection
• Modular DIN-Rail PC