With the semiconductor market poised for recovery in FY-2024 and a surge in demand anticipated from key customers, PacTech is strategically expanding its business footprint within the Southeast Asian supply chain. This expansion involves significant investments, including $10 million in additional cleanroom space totaling 20,000 sqft, cutting-edge equipment, and factory automation. These enhancements to PacTech Asia’s manufacturing capabilities will result in a substantial increase in bumping capacity, reaching up to 50,000 wafers per month.
Dr. Thorsten Teutsch, CEO of PacTech, expressed enthusiasm about the investment, stating, "We are thrilled to bolster our support for key customers by enhancing our capabilities and capacity. This investment reflects years of dedication, innovation, and hard work, which have earned us the trust and business of our long-term partners. Even amidst global economic challenges, our robust and successful business model continues to thrive."
About PacTech
PacTech is a global leader in advanced wafer bumping, packaging, and solder ball placement equipment. The company also offers plating chemistries and high-volume subcontractor bumping and die prep services for semiconductors, catering to diverse applications in consumer electronics, automotive, RF, and AI technologies. With manufacturing facilities in Germany (HQ), the USA, and Malaysia, PacTech is well-positioned to support the evolving needs of the semiconductor industry worldwide.
For more information, please contact:
PacTech GmbH – Thomas Oppert
Email: oppert@pactech.de
PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services. Since our establishment, our team has been working relentlessly on developing new leading-edge technologies for the next generation applications. We are known to be highly adaptive to customization and unique applications. Our team of technical experts is striving to resolve various packaging challenges faced by the industry to provide our customers and partners more competitive solutions in terms of cost, time-to-market, and technology advancement. Our headquarter is located in Nauen, Germany with two operation and manufacturing sites in Santa Clara, CA, USA and Penang, Malaysia. Together with our sales and field service teams across the globe, we can cater to the demand within your region.
Pac Tech – Packaging Technologies GmbH
Am Schlangenhorst 7 – 9
14641 Nauen
Telefon: 033214495122
Telefax: +49 (3321) 4495110
https://www.pactech.com
Marketing
Telefon: 03321 4495 122
E-Mail: p.bubelt@pactech.de
