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EV Group and Fraunhofer IZM-ASSID expand partnership in Wafer Bonding for Quantum Computing applications
Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology Mehr