Firma Pac Tech – Packaging Technologies, Autor bei Presse-Blog

Pac Tech Asia investiert in den Ausbau der Dienstleistungskapazitäten in Malaysia

2. April 20244. April 2024 Firma Pac Tech – Packaging TechnologiesMikrotechnikausbau, Dienstleistungskapazitäten, Dr. Thorsten Teutsch, Geschäftsjahr 2024, GmbH, Halbleitermarkt, malaysia, Packaging Technologies, PacTech, tochtergesellschaft, Wafer Level Packaging

PacTech – Packaging Technologies GmbH (PacTech), ein renommierter Hersteller von lasergestützten Solder-Jetting- und Chip-Bonding-Anlagen sowie weltweit agierender Wafer-Level-Packaging-Dienstleister, freut sich, eine Investition von 10 Millionen US-Dollar zur Erweiterung der Kapazität seiner Tochtergesellschaft, PacTech Asia Sdn. Bhd. (PacTech Asia), mit Sitz Mehr

Pac Tech Asia Invests in Capacity Expansion of Malaysian Factory

2. April 20244. April 2024 Firma Pac Tech – Packaging TechnologiesMikrotechnikAdvanced Packaging Equipment, Electroless Plating, expansion, global leader, Pac Tech, Packaging Technologies GmbH, Wafer Level Packaging

Pac Tech Packaging Technologies GmbH (PacTech), a leading manufacturer of high-performance laser-assisted solder jetting and die bonding equipment, and a globally recognized wafer level packaging subcontractor, is proud to announce a $10 million investment to enhance the capacity of its Mehr

Pac Tech – Packaging Technologies GmbH Appoints New Vice Presidents to Lead Business Units

29. Februar 20241. März 2024 Firma Pac Tech – Packaging TechnologiesMikrotechnikAdvanced Packaging Equipment, Business Units, Electroless Plating, engineering, global leader, laser material processing, leadership, Manufacturer, Pac Tech, Packaging Technologies GmbH, project management, Strategic Initiatives, Subcontractor, Vice Presidents, Wafer Level Packaging

Pac Tech – Packaging Technologies GmbH (PacTech), a renowned manufacturer of high-performance laser-assisted solder jetting and die bonding equipment, along with its role as a globally operating wafer level packaging subcontractor, proudly announces the internal promotions of Ms. Sy Jiun Mehr

Forming of Advanced THT-Interconnects using SB² Laser Solder Jetting Process

20. Juni 202320. Juni 2023 Firma Pac Tech – Packaging TechnologiesMikrotechnikbonds, flux-free, hole, InterConnect, laser, NPTH, pin, pth, smt, solder, soldering, tgv, THT, tsv, via??

Conventional methods of soldering THT-contacts face growing limitations with new-generation products. Finer pitches, more intricate geometries, more excellent aspect ratios, thermally sensitive substrates, and an overall call for a flux-free bonding require different process solutions. SB² laser assisted solder jetting Mehr

Autor: Firma Pac Tech – Packaging Technologies